Method of preserving the solderability of copper

Details Method of preserving the solderability of copper Method of preserving the solderability of copper

1981-07-17

1983-02-15

Smith, John D.

Metal fusion bonding

Process

With pretreating other than heating or cooling of work part...

148614R, 427 96, 427327, 228206, 228180R, H05K 322

Patent

active

043736564

ABSTRACT:
A method for preserving the solderability of copper conductors comprises stabilizing a cleaned, mildly etched conductor surface with a phosphoric acid-glycol solution then immersing the surface in imidazole followed by a rinse to remove excess imidazole.

REFERENCES:
patent: 2163984 (1938-02-01), Petkovic
patent: 2742369 (1956-04-01), Hatch
patent: 3295917 (1967-01-01), Cotton
patent: 3864139 (1975-02-01), Heller
patent: 3891470 (1975-06-01), Kotone
patent: 3899364 (1975-08-01), Evans
patent: 3933531 (1976-01-01), Sawa
patent: 4046620 (1977-09-01), Andraseek
patent: 4059218 (1977-11-01), Choby
patent: 4123562 (1978-10-01), Chandross
patent: 4134959 (1939-01-01), Menke
patent: 4340167 (1982-07-01), Perker

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