Method and apparatus for solder leveling of printed circuit boar

Details Method and apparatus for solder leveling of printed circuit boar Method and apparatus for solder leveling of printed circuit boar

1990-12-17

1992-05-05

Seidel, Richard K.

Metal fusion bonding

Process

Applying or distributing fused filler

228 20, B08B 302

Patent

active

051100363

ABSTRACT:
Disclosed is a method and apparatus for fabricating workpieces such as printed circuit boards which include blowing excess solder off the board by a hot air solder leveling technique. A converging/diverging airknife design creates a shock wave, causing a high pressure, low velocity flow pattern which removes solder from the through-holes in the board while leaving sufficient solder on the surface mount features. Additionally, a Mach number of the fluid of less than 0.8 is created.

REFERENCES:
patent: 3661315 (1972-05-01), Hilton
patent: 3865298 (1975-02-01), Allen et al.
patent: 4356840 (1982-11-01), Friedland et al.
patent: 4578102 (1986-03-01), Colmon et al.
patent: 4619841 (1986-10-01), Schwerin
patent: 4776731 (1988-10-01), Briggs et al.
patent: 4847043 (1989-07-01), Gluntz
patent: 4958052 (1990-09-01), Mahieu
patent: 4995411 (1991-02-01), Lowell et al.

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