4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With semiconductor element forming part

John Harold Magerlein

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Apparatus and methods for high-performance liquid cooling of...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Apparatus and methods for microchannel cooling of...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Apparatus and methods for microchannel cooling of...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Chip cooling

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Combined resistor-capacitor elements for decoupling in...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2625529

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