Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-03-13
2007-03-13
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C257S714000, C165S080400, C174S015100
Reexamination Certificate
active
10883534
ABSTRACT:
Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density electronic devices. Apparatus for microchannel cooling include integrated microchannel heat sink devices and fluid distribution manifold structures that are designed to provide uniform flow and distribution of coolant fluid and minimize pressure drops along coolant flow paths.
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Bezama Raschid Jose
Colgan Evan George
Magerlein John Harold
Schmidt Roger Ray
Chervinsky Boris
DeRosa Frank V.
F. Chau & Associates LLC
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