Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-11-21
2006-11-21
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S700000, C165S080400, C257S714000, C257S715000, C174S015100
Reexamination Certificate
active
07139172
ABSTRACT:
Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density electronic devices having a non-uniform power density distribution, which are mounted face down on a package substrate. For example, integrated microchannel cooler devices (or microchannel heat sink devices) for cooling IC chips are designed to provide uniform flow and distribution of coolant fluid and minimize pressure drops along coolant flow paths, as well as provide variable localized cooling capabilities for high power density regions (or “hot spots”) of IC chips with higher than average power densities.
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Bezama Raschid Jose
Colgan Evan George
Magerlein John Harold
Schmidt Roger Ray
Chervinsky Boris
DeRosa Frank V.
F. Chau & Associates
International Business Machines - Corporation
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