4. Chemistry: electrical and wave energy
  5. Processes and products
  6. Coating, forming or etching by sputtering

John H. Givens

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Alloy for enhanced filling of high aspect ratio dual damascene s

Metal treatment – Stock – Aluminum base
Patent

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Deposition chamber with a biased substrate configuration

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent

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Electrical connection for a semiconductor structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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High aspect ratio metallization structures for shallow...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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High aspect ratio metallization structures for shallow...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Profile ID: LFUS-PAI-P-184337

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