Metal treatment – Stock – Aluminum base
Patent
1998-03-10
1999-11-09
Ip, Sikyin
Metal treatment
Stock
Aluminum base
148439, 420537, 420534, 257765, C22C 2112
Patent
active
059806575
ABSTRACT:
An integrated circuit alloy is described which reduces the alloy melting temperature for improved coverage of high aspect ratio features with a reduced deposition pressure. The alloy is used to fabricate metal contacts and interconnects in integrated circuits, such as memory devices. The contacts and interconnects can be high aspect ratio features formed using a dual damascene process. An aluminum interconnect alloy is described for use in an integrated circuit which includes Al, Cu, Si. Ge and Mg can also be provided in the alloy. The composition of Si+Ge+Mg provides a melting temperature of the aluminum interconnect alloy which is between 500 and 550.degree. C.
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Farrar Paul A.
Givens John H.
Ip Sikyin
Micro)n Technology, Inc.
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