4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With contact or lead

John F. McCormack

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Hybrid circuits and a method of manufacture

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Inverted chip bonded module with high packaging efficiency

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Inverted chip bonded module with high packaging efficiency

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent

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Inverted chip bonded with high packaging efficiency

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Package for electronic devices

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Patent

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Profile ID: LFUS-PAI-P-614959

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