Hybrid circuits and a method of manufacture

Details Hybrid circuits and a method of manufacture Hybrid circuits and a method of manufacture

1993-12-22

1995-01-03

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156644, 156656, 1566591, 156901, B44C 122, C23F 100

Patent

active

053783131

ABSTRACT:
A method of manufacturing high connectivity ceramic multichip modules (MCM-C) using previously fired ceramic substrates, thick film dielectric layers and laser drilled vias. The laser energy is controlled in proportion to the thickness of the dielectric layer so that vias penetrate through the dielectric layers, but do not penetrate the underlying conductors. To minimize laser damage to the underlying conductors, the dielectric composition comprises fillers or pigments selected to absorb light at the wavelength emitted by the laser.

REFERENCES:
patent: 4657778 (1987-04-01), Moran
patent: 5287619 (1994-02-01), Smith et al.
patent: 5322593 (1994-06-01), Hasegawa et al.
Hargis, Ceramic Multichip Modules (MCM-C), Inside ISHM, Mar./Apr. 1993 (vol. 20, No. 2) pp. 15-18.
Danner & Sanow, Transfer Tape MCM-C, Inside ISHM, Mar./Apr. 1993 (vol. 20, No. 2) pp. 19-20.

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