Package for electronic devices

Details Package for electronic devices Package for electronic devices

1999-05-13

2000-12-26

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

438106, 438107, 438108, 438613, B01J 3100, B01J 3700, C08F 402, C08F 460

Patent

active

061658200

ABSTRACT:
An electronic packaging module for bonding of power semiconductor devices is produced. The semiconductor device is mounted on a base, and enclosed by a frame and lid. The lid is an insulating substrate having a conductive pattern with protuberances on the conductive pattern of the substrate. The protuberances are of a soft, ductile metal capable of being metallurgically bonded to the metallization pads of semiconductor devices. The metal protuberances are bonded to the semiconductor device joining it to the lid, and through the conductive pattern of the lid connecting the device to the input/output contacts of the package.

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