4. Metal fusion bonding
  5. Solder form

John C. Milliken

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Interconnection structure and test method

Metal fusion bonding – Process – Plural joints
Patent

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Interconnection structure and test method

Metal fusion bonding – Solder form
Patent

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Surface mount chip package having an array of solder ball contac

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
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Profile ID: LFUS-PAI-P-947302

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