4. Adhesive bonding and miscellaneous chemical manufacture
  5. Delaminating processes adapted for specified product
  6. Delaminating in preparation for post processing recycling step

Joerg Muchow

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Circuit configuration for compensating the temperature...

Electricity: measuring and testing – Impedance – admittance or other quantities representative of... – Using a particular bridge circuit
Reexamination Certificate

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Membrane sensor

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal
Reexamination Certificate

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Method for manufacturing semiconductor components having...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate

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Method of fabricating a micromechanical sensor

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Patent

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Method of structuring a semiconductor chip

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Profile ID: LFUS-PAI-P-713944

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