4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Metallic housing or support

Jinbang Tang

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Electronic device including a conductive stud over a bonding...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Electronic device including dies, a dielectric layer, and a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device
Reexamination Certificate

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Integrated circuit module and method of packaging same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Integrated conformal shielding method and process using...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Method and apparatus for mini module EMI shielding evaluation

Electricity: measuring and testing – Impedance – admittance or other quantities representative of... – Parameter related to the reproduction or fidelity of a...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2258415

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