Electronic device including dies, a dielectric layer, and a...

Details Electronic device including dies, a dielectric layer, and a... Electronic device including dies, a dielectric layer, and a...

2011-07-12

2011-07-12

Mandala, Victor (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For high frequency device

C257S660000, C257SE23114

Reexamination Certificate

active

07977785

ABSTRACT:
An electronic device and a method of packaging an electronic device are disclosed. In one embodiment, the electronic device can include a first die. The electronic device can also include a dielectric layer defining a first opening. The first die can be disposed within the first opening. Further, the electronic device can include an encapsulating material disposed adjacent to the first die. The encapsulating material can have a different composition as compared to the dielectric layer. In a particular embodiment, the electronic device can also include an electrically conductive carrier contacting the dielectric layer and the encapsulating material.

REFERENCES:
patent: 5985736 (1999-11-01), Orlowski et al.
patent: 6873044 (2005-03-01), Ammar
patent: 7294529 (2007-11-01), Tuominen
patent: 2003/0122250 (2003-07-01), Matsuta
patent: 2006/0131736 (2006-06-01), Jansman et al.
patent: 2008/0266829 (2008-10-01), Tang et al.
Rogers Corporation, RO4000 Series High Frequency Circuit Materials (Woven Glass Reinforced, Ceramic Filled Thermoset), http://www.rogerscorp.com, Jan. 17, 2009, 4 pages.
Rogers Corporation, RO4000 Series High Frequency Circuit Materials (Woven Glass Reinforced, Ceramic Filled Thermoset), http://www.rogerscorp.com, Jan. 17, 2009, 4 pages.

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