Integrated circuit module and method of packaging same

Details Integrated circuit module and method of packaging same Integrated circuit module and method of packaging same

2010-06-30

2010-11-30

Lee, Eugene (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257S664000, C257S680000, C257S686000, C257S712000, C257S713000, C257S723000, C257S728000, C257S773000, C257SE23141, C257SE23169, C257SE21499

Reexamination Certificate

active

07842546

ABSTRACT:
An integrated circuit (IC) module (20) includes a ground plane (22) having adjoining cutouts (30, 32). The cutout (32) defines a critical signal pathway (38). A device (24) is positioned in the cutout (30) and a device (26) is positioned outside of the cutout (30) adjacent to the cutout (32). An electrical interconnect (56) positioned in the critical signal pathway (38) interconnects the device (24) with the device (26). A method (60) of packaging the IC module (20) entails encapsulating the ground plane (22) and devices (24, 26) in a packaging material, and forming conductive vias (92) in the packaging material (84) that extend between the ground plane (22) and an exterior surface (94) of the packaging material (84). The conductive vias (92) surround the device (24) and cutout (32) to protect again electromagnetic interference and to provide guided signal pathways for high frequency signals on electrical interconnect (56).

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