4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With provision for cooling the housing or its contents

Jin-Yang Lee

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Memory module, socket and mounting method providing improved...

Electrical connectors – With insulation other than conductor sheath – Plural-contact coupling part
Reexamination Certificate

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Semiconductor chip package with thermoelectric cooler

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Semiconductor module with heat sink and method thereof

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3092430

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