Electrical connectors – With insulation other than conductor sheath – Plural-contact coupling part
Reexamination Certificate
2005-03-30
2009-02-03
Hammond, Briggitte R (Department: 2833)
Electrical connectors
With insulation other than conductor sheath
Plural-contact coupling part
Reexamination Certificate
active
07485006
ABSTRACT:
In a memory module, a gap filler for eliminating an air gap may be formed on an end of a PCB where a tab may be formed. The gap filler may be formed on a surface of a socket receiving the memory module. A grease may be coated on the tab to provide a heat conduction path away from the memory module.
REFERENCES:
patent: 5751553 (1998-05-01), Clayton
patent: 6002589 (1999-12-01), Perino et al.
patent: 6234820 (2001-05-01), Perino et al.
patent: 6341966 (2002-01-01), Takada et al.
patent: 6449159 (2002-09-01), Haba
patent: 7029324 (2006-04-01), Annequin
patent: 7122889 (2006-10-01), Belgacem
patent: 2004/0241417 (2004-12-01), Fischer et al.
patent: 2000113920 (2000-04-01), None
patent: 20-0203858 (2000-09-01), None
patent: 10-0338225 (2002-05-01), None
Baek Joong-Hyun
Choi Hee-Kook
Lee Hae-Hyung
Lee Jin-Yang
Park Sang-Wook
Hammond Briggitte R
Harness Dickey & Pierce PLC
Samsung Electronics Co,. Ltd.
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