Semiconductor chip package with thermoelectric cooler

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

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Details

C257S686000, C257S706000, C257S713000, C257SE23085

Reexamination Certificate

active

11169615

ABSTRACT:
The semiconductor chip package may include a substrate having circuit patterns and substrate pads connected with the circuit patterns. At least one semiconductor chip is mounted on the substrate, and a thermoelectric cooler having a P-type material plate and an N-type material plate is mounted on the semiconductor chip. Portions of the P-type and N-type material plates may be attached on the semiconductor chip. The P-type and N-type material plates may be electrically connected to the circuit patterns of the substrate to be provided with DC power.

REFERENCES:
patent: 5012325 (1991-04-01), Mansuria et al.
patent: 5367890 (1994-11-01), Doke
patent: 6492585 (2002-12-01), Zamboni et al.
patent: 2002/0024154 (2002-02-01), Hara et al.
patent: 2004/0245592 (2004-12-01), Harmon et al.
patent: 2005/0077619 (2005-04-01), Ramanathan et al.
patent: 2003-017638 (2003-01-01), None
patent: 1020020091792 (2002-12-01), None
patent: 2003-0011159 (2003-02-01), None
Korean Office Action dated Feb. 6, 2006.

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