4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated

Jin-Chuan Bai

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Chip photoelectric sensor assembly and method for making same

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate

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Fabrication method for circuit board

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Fabrication method of circuit board

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Semiconductor device and method for fabricating the same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate

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Semiconductor device and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2544186

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