Chip photoelectric sensor assembly and method for making same

Details Chip photoelectric sensor assembly and method for making same Chip photoelectric sensor assembly and method for making same

2001-06-18

2003-03-11

Zarabian, Amir (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S065000, C438S066000, C438S067000, C438S116000, C257S433000, C257S434000

Reexamination Certificate

active

06531333

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to a chip photoelectric sensor assembly and a method for making the chip photoelectric sensor assembly.
BACKGROUND OF THE INVENTION
As shown in
FIG. 1
, a chip photoelectric sensor assembly of the prior art has a photoelectric sensor chip
10
which is attached to a substrate
12
such that the chip
10
is electrically connected with the substrate
12
by a plurality of leads
14
. The chip
10
is provided on the top thereof with a protective layer
16
which is made of a transparent resin material by molding.
Such a prior art chip photoelectric sensor as described above is defective in design in that the protective layer
16
is excessively thick and is apt to cause the refraction of light passing through the protective layer
16
. Generally speaking, the optimal thickness of the protective layer
16
is about 50 microns.
As shown in
FIG. 2
, another prior art chip photoelectric sensor has a photoelectric sensor chip
21
which is provided on the top thereof with a protective layer
20
, and in the underside thereof with a plurality of electrodes
22
, with each having a projection
23
conductive to electricity. The chip
21
is further provided with a photoelectric sensor
24
and a transparent insulation layer
25
made of a resin material. The transparent insulation layer
25
is intended for use in mounting the chip
21
on an electrically-conductive layer
27
which is mounted on a glass substrate
26
. This prior art chip photoelectric sensor assembly is susceptible to distortion which is brought about by the refraction of light passing through the glass substrate
26
and the transparent insulation layer
25
.
SUMMARY OF THE INVENTION
The primary objective of the present invention is to provide a method for making a chip photoelectric sensor assembly which is free from the drawbacks of the prior art chip photoelectric sensor assemblies described above.
In keeping with the principle of the present invention, the foregoing objective of the present invention is attained by a chip photoelectric sensor assembly comprising a substrate, a printed circuit board mounted on the top of the substrate, a photoelectric sensor chip disposed on the top of the printed circuit board and provided on the top thereof with a photosensitive area which is formed by a plurality of photosensors, and a plurality of electric connection ports. The electric connection: ports are connected with the printed circuit board. The electrically-connected portion of the photoelectric sensor chip and the substrate is protected by an insulation layer. The photosensitive area of the photoelectric sensor chip is provided with a transparent protective layer of a hard coating material. In light of the transparent protective layer being very thin, the light refraction is averted.
The chip photoelectric sensor assembly is coated with a transparent layer of the hard coating material. A rigid transparent protective layer is formed only in the photosensitive area of the photoelectric sensor chip by the photolithographic process.


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