Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
Inventor
active
Bridging method of interconnects for integrated circuit packages
Method and apparatus for nondestructive inspection and defect de
Multichip assembly semiconductor
Multichip semiconductor assembly
Stacked flip-chip integrated circuit assemblage
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Profile ID: LFUS-PAI-P-1497610