Bridging method of interconnects for integrated circuit packages

Details Bridging method of interconnects for integrated circuit packages Bridging method of interconnects for integrated circuit packages

1998-05-29

2000-07-04

Hardy, David

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257778, 257758, H01L 23535

Patent

active

060843063

ABSTRACT:
An integrated circuit package (30) having first and second layers (76, 78), a plurality of routing pads (82) being integral with the first layer (76), a plurality of upper and lower conduits (18, 118), respectively, disposed on the upper and lower surfaces (92, 94) of the first layer (76), at least one of the upper conduits (18) electrically connected to at least one of the lower conduits (118), a plurality of pads (100) disposed on the second layer (78), vias (84) that electrically connect the pads (100) to the lower conduits (118) and a chip (50) adhered to the second layer (78) having bonding pads (120) at least one of which is electrically connected to at least one of the routing pads (82), is disclosed.

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