Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
Inventor
active
Affixing pluggable pins to a ceramic substrate
Carrier for test, burn-in, and first level packaging
Carrier for test, burn-in, and first level packaging
Charge-coupled device wafer cover plate with compact...
Direct chip attachment (DCA) with electrically conductive adhesi
No associations
LandOfFree
Jerzy M. Zalesinski does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Jerzy M. Zalesinski, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Jerzy M. Zalesinski will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-120239