Direct chip attachment (DCA) with electrically conductive adhesi

Details Direct chip attachment (DCA) with electrically conductive adhesi Direct chip attachment (DCA) with electrically conductive adhesi

1994-02-02

1996-08-06

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174260, 361768, 361770, 361767, H05K 118

Patent

active

055435858

ABSTRACT:
A simple process for card assembly by Direct Chip Attachment (DCA) uses electrically conductive adhesives. Two methods create the same intermediate wafer product with a layer of insulative thermoplastic and conductive thermoplastic bumps. After sawing or dicing the wafer to form the chips, the chips are adhered to chip carriers with conductive pads which match the conductive thermoplastic bumps, using heat and pressure. Chips may be easily removed and replaced using heat.

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