4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

Jeong-Woo Seo

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Ball grid array package having improved reliability and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Lead-on-chip type semiconductor chip package using an adhesive d

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent

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Portable battery charger having a separate battery pack

Electricity: battery or capacitor charging or discharging – Cell or battery charger structure – For battery pack
Reexamination Certificate

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Semiconductor package with heat dissipating structure and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1309618

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