Lead-on-chip type semiconductor chip package using an adhesive d

Details Lead-on-chip type semiconductor chip package using an adhesive d Lead-on-chip type semiconductor chip package using an adhesive d

1996-11-08

1998-07-07

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438111, 438123, H01L 2160

Patent

active

057767998

ABSTRACT:
A lead-on-chip package manufacturing method includes an insulating liquid adhesive depositing step on lead attaching regions formed on an active surface of a semiconductor on a wafer. The adhesive deposition may be accomplished by a screen printing method in which the adhesive is forced through hole patterns of a metal screen, or by a dispensing method in which a liquid adhesive is dispensed from needles of a dispensing head that is movable over the wafer surface and is aligned with the wafer. The dispensing technique may be applied to a plurality of chips in step-by-step fashion, or in a simultaneous manner by using a multi-needled dispensing head.

REFERENCES:
patent: 4796078 (1989-01-01), Phelps, Jr. et al.
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4989068 (1991-01-01), Yasuhara et al.
patent: 5086018 (1992-02-01), Conru et al.
patent: 5221642 (1993-06-01), Burns
patent: 5227661 (1993-07-01), Heinen
patent: 5535509 (1996-07-01), Tomita et al.
patent: 5627108 (1997-05-01), Alibocos et al.

Affiliated with

Also associated with

Rating

Lead-on-chip type semiconductor chip package using an adhesive d does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead-on-chip type semiconductor chip package using an adhesive d, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead-on-chip type semiconductor chip package using an adhesive d will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1205045