Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-04-10
2007-04-10
Tran, Minhloan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S706000, C257S707000, C257S712000, C257S713000, C257SE23080, C257S669000, C257S675000, C257SE23104, C257SE23101, C257SE23102
Reexamination Certificate
active
11046514
ABSTRACT:
A semiconductor package in which heat is easily dissipated and a semiconductor chip is not damaged during a molding process, and a method of manufacturing the same. The semiconductor package with a heat dissipating structure includes a substrate, a semiconductor chip, which is mounted on the substrate and electrically connected with the substrate by bonding means, a heat slug which is adhered to the semiconductor chip and formed of a thermally conductive material, and a heat spreader partially exposed to the outside of the semiconductor package, and which is formed on the heat slug to be spaced a buffer gap apart from the heat slug.
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Marger & Johnson & McCollom, P.C.
Rodela Eduardo A.
Samsung Electronics Co,. Ltd.
Tran Minhloan
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