Ball grid array package having improved reliability and...

Details Ball grid array package having improved reliability and... Ball grid array package having improved reliability and...

2006-07-04

2006-07-04

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S127000, C438S458000

Reexamination Certificate

active

07071027

ABSTRACT:
A ball grid array package utilizing a layer of an elastic insulating material to protect conductive ball lands from deformation during subsequent processing and use of the resulting device and a method of manufacturing the same are disclosed. The elastic insulating layer preferably has a modulus of elasticity no greater than about 20 MPa or less to absorb and or distribute mechanical stress applied to conductive ball lands directly or through solder ball joints or other structures and thereby improve the solder joint reliability (SJR) of the resulting device.

REFERENCES:
patent: 6404214 (2002-06-01), Muramatsu et al.
patent: 6483191 (2002-11-01), Umezaki
patent: 6576984 (2003-06-01), Takahashi et al.
patent: 2002/0056561 (2002-05-01), Yaguchi et al.
patent: 2002/0079575 (2002-06-01), Hozoji et al.
patent: 10-2000-0076871 (2000-12-01), None
patent: 2001-0061888 (2001-07-01), None
patent: 10-2002-0034958 (2002-05-01), None
patent: 2002-34958 (2002-05-01), None
Korean Office Action dated Oct. 10, 2005 for Korean Application No. 10-2003-000005935 (Complete English translation provided).
Korean Patent Office Action dated Dec. 18, 2004, KR Appl. No. 10-2003-0005935 (with English language translation).

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