Tape automated bonding apparatus with automatic leveling stage

Details Tape automated bonding apparatus with automatic leveling stage Tape automated bonding apparatus with automatic leveling stage

1991-05-22

1992-07-07

Seidel, Richard K.

Metal fusion bonding

Process

Plural joints

228 62, 228 55, B23K 3102

Patent

active

051275732

ABSTRACT:
An improveent in a Tape Automated Bonding (TAB) apparatus wherein a support for the device being bonded to a tape, or film carrier, is provided that will automatically adjust the position of the device supported thereon to conform to the bonding surface of the thermode. The support of the invention has a central member that provides for swivelling and a second member that prevents relative rotation.

REFERENCES:
patent: 3448911 (1969-06-01), Cushman
patent: 3574923 (1971-04-01), Cushman
patent: 4565314 (1986-01-01), Scholz
patent: 4896811 (1990-01-01), Dunn et al.
patent: 4982890 (1991-01-01), Schuster et al.
Anonews, vol. 9, No. 4, Jun. 1990, p. 1, Anorad Corp., Hauppauge, NY.
"Tab Tames High Density Chip Input/Outputs," Electronic Packaging and Production, Dec. 1988, pp. 42-44.

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