Mold and method of molding semiconductor devices

Details Mold and method of molding semiconductor devices Mold and method of molding semiconductor devices

2007-07-24

2007-07-24

Davis, Robert B. (Department: 1722)

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

C425S116000, C425S121000, C425S129100, C438S112000, C438S127000

Reexamination Certificate

active

10710906

ABSTRACT:
A mold for molding semiconductor devices mounted on a package substrate is provided. The mold comprises a top mold and a bottom mold. The top mold has a top runner, at least a first dummy runner and a plurality of mold cavities. The first dummy runner connects with the top runner and the top runner extends into a space between the mold cavities. The mold cavities for accommodating the semiconductor devices are connected to the top runner. The bottom mold has a bottom runner and at least a second dummy runner. The second dummy runner connects with the bottom runner. The second dummy runner is above but separated from the first dummy runner by the package substrate.

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