Thermally enhanced package structure

Details Thermally enhanced package structure Thermally enhanced package structure

2008-07-31

2011-11-15

Nguyen, Hoa C (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S768000, C361S688000, C361S707000, C361S711000, C361S717000

Reexamination Certificate

active

08059422

ABSTRACT:
A manufacturing process for a thermally enhanced package is disclosed. First, a substrate strip including at least a substrate is provided. Next, at least a chip is disposed on an upper surface of the substrate, and the chip is electrically connected to the substrate. Then, a prepreg and a heat dissipating metal layer are provided, and the heat dissipating metal layer is disposed on a first surface of the prepreg and a second surface of the prepreg faces toward the chip. Finally, the prepreg covers the chip by laminating the prepreg and the substrate.

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patent: 2008/0101044 (2008-05-01), Chang
patent: 2009/0129037 (2009-05-01), Yoshino

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