4. Semiconductor device manufacturing: process
  5. Bonding of plural semiconductor substrates
  6. Thinning of semiconductor substrate

Jeffrey D. Hartman

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Method for integrating silicon CMOS and AlGaN/GaN wideband...

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Field effect transistor
Reexamination Certificate

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Method for integrating silicon CMOS and AlGaN/GaN wideband...

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Field effect transistor
Reexamination Certificate

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Method of thinning a semiconductor structure

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3106078

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