4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Wire contact, lead, or bond

Janos Farkas

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Call admission control system and method for interpreting...

Multiplex communications – Data flow congestion prevention or control – Control of data admission to the network
Reexamination Certificate

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Chemical mechanical polishing (CMP) slurry for copper and method

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Patent

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Chemical mechanical polishing (CMP) slurry for polishing copper

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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CMP metal polishing slurry and process with reduced solids...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Integrated circuit having a support structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Patent

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Profile ID: LFUS-PAI-P-326724

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