Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
Inventor
active
Flip chip package with heat spreader allowing multiple heat...
Heat sink structure with pyramidic and base-plate cut-outs
Method and system for measuring temperature and power...
Method of forming a flip-chip package
Optimized thermally conductive plate and attachment method...
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Profile ID: LFUS-PAI-P-2284455