Optimized thermally conductive plate and attachment method...

Details Optimized thermally conductive plate and attachment method... Optimized thermally conductive plate and attachment method...

2008-01-15

2008-01-15

Duverne, J. F. (Department: 2839)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

Reexamination Certificate

active

07319591

ABSTRACT:
Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.

REFERENCES:
patent: 4939570 (1990-07-01), Bickford et al.
patent: 5081067 (1992-01-01), Shimizu et al.
patent: 6774493 (2004-08-01), Capote et al.
patent: 6806567 (2004-10-01), Hembree
patent: 2002/0135052 (2002-09-01), Alcoe et al.
patent: 2003/0001248 (2003-01-01), Alcoe et al.
patent: 05-206340 (1993-08-01), None
patent: 09-083165 (1997-03-01), None
patent: 11-163231 (1999-06-01), None
patent: 2003-68949 (2003-03-01), None

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