Data processing: measuring – calibrating – or testing – Measurement system – Temperature measuring system
Reexamination Certificate
2007-01-23
2007-01-23
Tsai, Carol S. W. (Department: 2857)
Data processing: measuring, calibrating, or testing
Measurement system
Temperature measuring system
C702S060000, C702S064000, C702S136000, C700S022000, C361S601000, C438S014000, C324S451000, C374S057000, C374S178000
Reexamination Certificate
active
10919692
ABSTRACT:
A present invention provides real-time temperature and power mapping of fully operating electronic devices. The method utilizes infrared (IR) temperature imaging, while an IR-transparent coolant flows through a specially designed cell directly over the electronic device. In order to determine the chip power distributions the individual temperature fields for each heat source of a given power and size on the chip (as realized by a scanning focused laser beam) are measured under the same cooling conditions. Then the measured chip temperature distribution is represented as a superposition of the temperature fields of these individual heat sources and the corresponding power distribution is calculated with a set of linear equations.
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patent: 6853944 (2005-02-01), Fan
patent: 2005/0125174 (2005-06-01), Nam et al.
Deeney, ‘Thermal Modeling and Measurement of Large High Power Silicon Devices with Asymmetric Power Distribution’, Jan. 2000, HP Publication, pp. 1-7.
Hamilton, ‘Thermal Aspects of Burn-In of High Power Semiconductor Devices’, 2002, IEEE Publication, pp. 626-634.
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Hamann Hendrik F.
Lacey James A.
O'Boyle Martin P.
von Gutfeld Robert J.
Wakil Jamil A.
Desta Elias
Fleit Kain Gibbons Gutman Bongini & Bianco P.L.
Gibbons Jon A.
International Business Machines - Corporation
Tsai Carol S. W.
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