4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. On insulating carrier other than a printed circuit board

James Warren Wilson

Inventor

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active

Ball grid array having no through holes or via interconnections

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Electronic Package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Electronic package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Electronic package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Integrated manufacturing packaging process

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Profile ID: LFUS-PAI-P-92479

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