Ball grid array having no through holes or via interconnections

Details Ball grid array having no through holes or via interconnections Ball grid array having no through holes or via interconnections

1997-05-12

1999-10-19

Young, Lee

Metal working

Method of mechanical manufacture

Electrical device making

29843, 29846, 29852, 29DIG12, H05K 332

Patent

active

059668032

ABSTRACT:
An electronic device package in the form of a ball grid array package is formed adding a single layer of conductive material including circuitry having trace lines, wire bond pads, and solder ball pads electrically coupled together. Thin film circuitization techniques are used on a polyimide laminate substrate to accommodate greater than 100 input/output contacts of an electronic device on a single layer. Thus, the package will not have vias or other conductive type through holes as in multiple conductive layer ball grid array packages.

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IBM Technical Disclosure Bulletin vol. 32, No. 10A, Mar. 1990, "Thin Film Substrate For Wire Bonding".

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