Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
Inventor
active
Lamination and delamination technique for thin film processing
Lamination and delamination technique for thin film processing
Method of packaging and interconnection of integrated circuits
Method of packaging and interconnection of integrated circuits
Method of packaging and interconnection of integrated circuits
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Profile ID: LFUS-PAI-P-2242080