Method of packaging and interconnection of integrated circuits

Details Method of packaging and interconnection of integrated circuits Method of packaging and interconnection of integrated circuits

2007-11-27

2007-11-27

Parekh, Nitin (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S127000, C438S778000, C438S780000, C438S781000, C257S783000, C257S787000, C257SE23124

Reexamination Certificate

active

11206606

ABSTRACT:
A method is disclosed for packaging semiconductor chips on a flexible substrate employing thin film transfer. The semiconductor chips are placed on a temporary adhesive substrate, then covered by a permanent flexible substrate with a casting layer for planarizingly embedding the chips on the permanent substrate before removing the temporary substrate. With the surface of the chips coplanar with the surface of the complete structure without any gaps, interconnect metal lines can be easily placed on the uninterrupted surface, connecting the chips and other components.

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