4. Metal fusion bonding
  5. Process
  6. Preplacing solid filler

James Patrick Wood

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Apparatus and method for use in manufacturing semiconductor devi

Metal fusion bonding – Including means to apply flux or filler to work or applicator
Patent

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Apparatus and method for use in manufacturing semiconductor...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Apparatus for providing solder interconnections to semiconductor

Stock material or miscellaneous articles – Structurally defined web or sheet – Including sheet or component perpendicular to plane of web...
Patent

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Ball grid array by partitioned lamination process

Metal fusion bonding – Process – Preplacing solid filler
Patent

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Bottom-surface-metallurgy rework process in ceramic modules

Metal fusion bonding – Process – Repairing – restoring – or renewing product for reuse
Patent

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Profile ID: LFUS-PAI-P-16564

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