Bottom-surface-metallurgy rework process in ceramic modules

Details Bottom-surface-metallurgy rework process in ceramic modules Bottom-surface-metallurgy rework process in ceramic modules

1996-04-26

1998-03-03

Bradley, P. Austin

Metal fusion bonding

Process

Repairing, restoring, or renewing product for reuse

228264, 228 19, B23K 1018, B23K 3102

Patent

active

057225796

ABSTRACT:
Multi-chip modules provided with a pin array may, under close scrutiny, display certain defects that may cause reliability problems. The presence of even one such defect necessitates the scrapping of the module. A method of salvaging the module is described, wherein the module is reworked by the method comprising the steps of applying a shearing force against the pins. During which the module is exposed to a temperature at or above that which is necessary for softening the braze material to remove the pins; polishing the surface of the module including the pads; evaporating the new pads; and attaching new pins to the pads.

REFERENCES:
patent: 4327472 (1982-05-01), Krzeptowski
patent: 4632294 (1986-12-01), Drunchel et al.
patent: 4894910 (1990-01-01), Reimer et al.
patent: 5192843 (1993-03-01), Cargnel et al.
patent: 5284286 (1994-02-01), Brofman et al.
R.H. Cadwallader and H.R. Poweleit, "Substrate Tin Repair," IBM Tech. Discl. Bull., vol. 18, No. 10, Mar. 1976, pp. 3273-3274.
"Hot-Gas Pin Repair with Pin-Side Bias," IBM Tech. Discl. Bull., vol. 31, No. 9, Feb. 1989, pp. 342-345.
"Pin Attach Tool," Research Disclosure, Kenneth Mason Publications, Ltd., England, March 1990, No. 311.
"Pin Repair of MLC Substrate I/O Pads by Focused Ion Beam"Published Anonymously, Research Disclosure, No. 335, Kenneth Mason Pub. Ltd., England, March 1992.

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