Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
Inventor
active
Etched glass solder bump transfer for flip chip integrated circu
Etched glass solder bump transfer for flip chip integrated...
Focused particle beam processing for use in electronic...
Heater for membrane mask in an electron-beam lithography system
Hybrid molds for molten solder screening process
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Profile ID: LFUS-PAI-P-701100