Heater for membrane mask in an electron-beam lithography system

Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices

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2504922, H01J 3108

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active

057420653

ABSTRACT:
A method for reducing contamination in a silicon membrane mask in a lithography system is described. The method includes: doping the top surface of the silicon membrane mask with boron to lower the electrical resistance of the mask; subsequently metalizing the surface of the mask to further lower its electrical resistance; and, finally, applying a voltage between opposite surfaces of the mask, the voltage generating an electric field that passes through the membrane mask, heating the membrane mask. The method further includes: calculating distortions in the shape of each of the patterns within the mask caused by heating the membrane mask; compensating for the proximity of other shapes positioned in the vicinity of each of the patterns; and appropriately modifying the shape of each of the patterns. The above described method can be equally applied to an e-beam system or to an ion-beam lithography system, and both, to stencil masks and to scattering masks.

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patent: 5428203 (1995-06-01), Kusunose
H. C. Pfeiffer, "Variable Spot Shaping for Electron-Beam Lithography" J. Vac. Sci. Technol. 15(3), Amer. Vac. Society, pp. 887-890, May/Jun. 1978.
S.D. Berger, et al, "Projection Electron-Beam Lithography: A New Approach" J. Vac. Sci. Technol. B9(6), Amer. Vac. Society, pp. 29996-29999, Nov./Dec. 1991.
H. Itoh, et al., "Cell Projection Column for High Speed Electron Beam Lithography System" J. Vac. Sci. Technol. B(10)6, Amer. Vac. Society, pp. 2799-2803, Nov./Dec. 1992.
X. Pan, et al, "Improved Electron Beam Pattern Writing in Sio2 with the Use of a Sample Heating Stage" Appl. Phys. Lett. 63(10), Amer. Inst. of Physics, pp. 1441-1442, Sep. 6, 1993.

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