4. Adhesive bonding and miscellaneous chemical manufacture
  5. Delaminating processes adapted for specified product
  6. Delaminating in preparation for post processing recycling step

James K. Kai

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Dielectric layer above floating gate for reducing leakage...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Dual damascene process using sacrificial spin-on materials

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Dual damascene process using sacrificial spin-on materials

Semiconductor device manufacturing: process – Chemical etching
Patent

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Fluted via formation for superior metal step coverage

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Patent

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Fluted via formation for superior metal step coverage

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Profile ID: LFUS-PAI-P-117246

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