4. Metal fusion bonding
  5. Process
  6. Metal to nonmetal with separate metallic filler

Jagdish Belani

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One-piece interconnection package and process

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Semiconductor component package assembly including an integral R

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding – With means to shield device contained in housing or package...
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System for electroplating molded semiconductor devices

Chemistry: electrical and wave energy – Apparatus – Electrolytic
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Tape automated bonding of bumped tape on bumped die

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
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Profile ID: LFUS-PAI-P-764273

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