System for electroplating molded semiconductor devices

Details System for electroplating molded semiconductor devices System for electroplating molded semiconductor devices

1985-09-26

1986-06-17

Tufariello, T. M.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C25D 1708

Patent

active

045954801

ABSTRACT:
A system for electroplating metals, such as tin and solder on semiconductor lead frame strips includes a magazine for carrying the lead frames and a separate plating rack for carrying the magazines. The plating rack, which has an insulated surface, includes means for directing a current to the lead frame strips when the magazine is inserted in the plating rack. An electric coupling means is also provided for assuring that the current from the plating rack is evenly distributed among the individual lead frame strips so that uniform plating results. The magazine is suitable for transporting and storing the lead frame strips during assembly of semiconductor components, and it is unnecessary to remove the lead frame strips from the magazine for mounting on the plating rack.

REFERENCES:
patent: 2073679 (1937-03-01), Brown
patent: 3043767 (1962-07-01), Tobey

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