Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1990-01-05
1991-09-10
Heinrich, Samuel M.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
2281801, 228265, 357 70, B23K10140, H01L 21603, H05K 332
Patent
active
050466577
ABSTRACT:
A tape automated bonding structure (10) includes a copper flexible tape (12) with a plurality of conductive leads (14) having tips (16) arranged in a generally rectangular pattern corresponding to gold bumped contacts (18) on semiconductor die (20). The tips (16) of the conductive leads (14) are configured as bumps extending from the remainder of each conductive lead (14). The tips (16) of the conductive leads (14) are gang bonded to the bumped contacts (18) on the semiconductor die (20) by positioning the tips (16) in registration over each bumped contact and applying heat and pressure to urge the tips (16) and the bumped contacts together, thus forming a thermocompression bond. The harder copper tips (16) penetrate into the gold bumped contacts. The bumped contacts (18) and the remainder of the tips (16) that has not penetrated into the contacts (18) space the conductive leads (14) above surface (22) of the semiconductor die (20).
REFERENCES:
patent: 3501832 (1970-03-01), Iwata et al.
patent: 4000842 (1977-01-01), Burns
patent: 4607779 (1986-08-01), Burns
patent: 4707418 (1987-11-01), Takiar et al.
"Film-Carrier Technique Automates the Packaging of IC Chips", Grossman, 5/16/74.
"BTAB's Future--An Optimistic Prognosis", 400 Solid-State Technology, vol. 23 (1980), Mar., Unger, pp. 77-83.
Belani Jagdish
Iyer Venkat
Pendse Rajenda
Takiar Hem P.
Heinrich Samuel M.
National Semiconductor Corporation
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