Semiconductor component package assembly including an integral R

Details Semiconductor component package assembly including an integral R Semiconductor component package assembly including an integral R

1995-08-04

1997-07-22

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

With means to shield device contained in housing or package...

252659, 252787, H01L 23552

Patent

active

056506597

ABSTRACT:
A semiconductor component package assembly including an integral radio frequency and electromagnetic interference shield is disclosed herein. The assembly includes a support member which supports an IC chip and defines an array of conductive leads. An electrically conductive shield is positioned relative to the IC chip so as to form an integral RF/EMI barrier between the IC chip and the ambient surroundings of the overall assembly. In a preferred embodiment, the shield is formed from different layers of material and configured for electrical connection of at least one conductive layer to certain ones of the leads which may include one or more ground leads. In a method of the invention, a shield is provided which is thereafter fixedly attached to an intermediate assembly including an IC chip to form an integral RF/EMI shield between the chip and the the ambient environment

REFERENCES:
patent: 4680617 (1987-07-01), Ross
patent: 5151769 (1992-09-01), Immorlica, Jr. et al.
patent: 5406117 (1995-04-01), Dlugokecki et al.
MOS/LSI plastic package for 20 cents, Electronics, Dec. 6, 1971, p. 40.

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