Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2010-03-25
2011-11-08
Sarkar, Asok (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C257SE21503, C257SE21508, C438S108000
Reexamination Certificate
active
08053283
ABSTRACT:
A die level integrated interconnect decal manufacturing method and apparatus for implementing the method. In accordance with the technology concerning the soldering of integrated circuits and substrates, and particularly providing for solder decal methods forming and utilization, in the present instance there are employed underfills which consist of a solid film material and which are applied between a semiconductor chip and the substrate in order to enhance the reliability of a flip chip package. In particular, the underfill material increases the resistance to fatigue of controlled collapse chip connect (C4) bumps.
REFERENCES:
patent: 5128746 (1992-07-01), Pennisi et al.
patent: 5673846 (1997-10-01), Gruber
patent: 6746896 (2004-06-01), Shi et al.
Gruber Peter A.
Nah Jae-Woong
International Business Machines - Corporation
Morris, Esq. Daniel P.
Sarkar Asok
Scully , Scott, Murphy & Presser, P.C.
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